Side-coated substrate
Coating on the substrate side! Prevents powder drop from the edge caused by rubbing against the guide rail.
We would like to introduce our "Side Coated Substrate." Powder shedding from the opened sides of laminated substrates can affect the assembly process and become a source of foreign matter within the mold. By coating the sides of the openings, we contribute to solving problems during assembly. By applying a coating to the sides of the substrate, we prevent powder shedding from the edges that occurs when the substrate rubs against guide rails during transport. [Applications] ■ Device substrates ■ Substrates requiring resin molding, etc. *For more details, please refer to the PDF document or feel free to contact us.
- Company：三和電子サーキット
- Price：Other
